Senior/Staff Process Engineer (Flip Chip)

Core Responsibilities

• Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.

• DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.

• Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.

• Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).

• Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.

• Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.

• Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.

Key Requirements & Qualifications

• Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.

• Experience: 5+ years of hands-on industry experience in flip chip assembly.

• Technical Knowledge:

• Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.

• Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.

• Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.

• Software Tools: High proficiency with robust analytical platforms like JMP, Minitab.