We Love AI JobsSenior Board Design Engineer, Electro Optical
NVIDIAThe Senior Board Design Engineer will help develop next-generation electro-optical devices and subsystems for high-speed communications. The work combines board design and component evaluation with hands-on development and testing in a data center interconnect lab.
Skills & Expertise
Key Responsibilities
Develop electro-optical devices and subsystems for high-speed communications.
Specify, design, select, and characterize components for electro-optical subsystems and evaluation boards.
Conduct hands-on development and testing in a data center interconnect lab.
Full Description
The company's Advanced Research (ARG) team in Yokneam is looking for a Senior Electro-Optical / Board Design Engineer for research and development. The ARG group is doing research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication. Our solutions include laser diodes, photo-diodes, modulators, and electronics for use in optoelectronics. The selected candidate would work as part of a multi-disciplinary team, composed of engineers and researchers, supporting the development of future components and systems, for current and next generations.
What you’ll be doing:
• Take part in research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication.
• The candidates tasks will include electrical specification of EO sub-systems and evaluation boards, schematic design, component selection and characterization, layout considerations and implementation, Fabrication and Assembly guidance.
• Hands-on development and testing within Data Center interconnect lab environment.
What we need to See:
• B.Sc./M.S.c.in Electrical Engineering or Practical Engineer certificate or equivalent experience.
• 10+ years experience with electro-optical and High-Speed Board Design.
• Strong background in high-frequency and broadband (>20GHz) design.
• Strong system-level understanding.
• Background in thermal and mechanical design considerations.
• Good SI/PI understanding in perspective of multi-layer PCB design.
• Experience in electro-optical and High-Speed lab environment – High-end measurements.
• Knowledge of electro-optical components: Drivers, CDR, Gearbox, DSP, Lasers, Detectors, Amplifiers…etc.
• Strong abilities to work as part of a team. Highly motivated.
Ways to stand out from the crowd:
• Design and knowledge with Data-Center environment [Switches/CPU/DPU/GPU]
• Experience in layout extraction and board-level simulation.
• Knowledge with board-design tools (Cadence environment).
• Familiar with NRZ/PAM-4 signaling schemes as well as familiar with various communication protocols: SPI, I2C, SerDes, PCIe, Ethernet.
• Previous experience as a technician\Practical Engineer at IDF technology units.